M. J. Lercel, G. F. Redinbo, F. D. Pardo, M. Rooks, R. C. Tiberio, P. Simpson, H. G. Craighead, C. W. Sheen, A. N. Parikh, D. L. Allara, Journal of Vacuum Science & Technology B 12, 3663 (1994)

Self‐assembled monolayers have been modified with focused electron beams of energy 1–50 keV and scanning tunneling microscopy(STM) based lithography with energies of ∼10 eV. Modifications ∼15 nm in size have been formed by STM and ∼25 nm in size by 50 keV beams. The fact that these materials work as self‐developing electron beam resists is demonstrated by both atomic force microscopy imaging and pattern transfer using conventional wet etchants. Patterns have been transferred to silicon substrates to a depth of ≳120 nm with a multistep wet etching process. The mechanism of electron beam modification has also been explored to better design future monolayer processes.